Snapdragon 670 tipped to feature next gen. Kryo 360 cores

A few months ago, Qualcomm launched its mid-range processor Snapdragon 660. Currently, there are very few smartphones that feature the said processor. However, it is said to deliver better performance than many other high-end chipsets

Meanwhile, Qualcomm is also working on its processor the Snapdragon 670. Yesterday, tipster Roland Quandt spotted it on the second page of Qualcomm's website. While the website doesn't reveal a single thing, a Weibo user has come up with bits of information about the chipset. As per the Weibo post, the Snapdragon 670 SoC is built on 10nm LPP (Low Power Plus) manufacturing process from Samsung.

For comparison, the Snapdragon 835 is built on LPE (Low Power Early), which is the predecessor to the LPP process. Hence, the new LPP process is expected to improve the performance and efficiency of the chipset to a great extent. Just like the Snapdragon 835, the Snapdragon 670 chipset will be comprised of eight cores. Qualcomm is believed to use the third generation Kryo 360 cores on the processor. These cores will be based on DynamIQ architecture, which is the successor to the widely-used big.LITTLE architecture from ARM. The chipset is said to use two high-power Kryo 360 cores and six low power Kryo cores. Besides this, the source also reveals, the Snapdragon 670 SoC will be topped with a new 600 series Adreno GPU. If you are wondering about the processor's launch, its mass production is speculated to start from Q1 2018. We are expecting more details about the Snapdragon 670 to emerge in the following days.